Renesas announced the SLG46801 on September 24, 2026. It is a configurable mixed-signal IC in the company's GreenPAK family, and in its press release Renesas calls it the industry's smallest GreenPAK configurable mixed-signal device offered in both WLCSP and STQFN packages. The two packages are a 9-ball WLCSP measuring 1.155mm × 1.155mm and a 12-lead STQFN measuring 1.6mm × 1.6mm × 0.55mm. The press release does not give a launch price.

The headline change is the memory. The SLG46801 stores its configuration in multi-time programmable (MTP) non-volatile memory that can be configured in-system over I²C, so bug fixes, updates and configuration changes can be made after the part is integrated into the end product. Renesas adds optional CRC-8 and read-back protection. The device supports operation and programming across a 1.71V to 5.5V supply range, which Renesas describes as "the widest operating and configurable range among MTP GreenPAK devices."

What is inside

The Renesas product page, which labels the part "NEW" and "Preview", lists:

  • 10 GPIOs
  • Tolerant GPIO pins that can be safely driven above VDD: one in the WLCSP package, two in the STQFN package
  • Up to 12 LUTs and 6 D flip-flops
  • Three combination function macrocells: 3-bit LUTs or DFF/Latches with Reset/Set
  • Three multi-function macrocells: selectable DFF/Latches or 3-bit LUTs + 8-bit delay/counters
  • Up to 6 CNT/DLY blocks, including three 8-bit delay/counters
  • One programmable delay with edge detector output
  • Two high-speed analog comparators (ACMPs)
  • 10kHz and 25MHz oscillators
  • 1.71V to 5.5V operating and program/erase VDD range
  • -40°C to +105°C operating temperature range
  • MTP memory with read-back protection (read lock); power-on reset with optional CRC
  • I²C-compatible serial interface, also used for MTP reprogramming

Renesas says GPIO pins can be repurposed dynamically for the I²C interface, which helps in designs with limited pin availability. The two packages let customers "balance minimum board area with additional GPIO availability and industrial package preferences": the WLCSP has the smaller footprint, while the STQFN, according to the product page, "offers a higher GPIO count." The 10-GPIO figure is listed against the 12-lead STQFN, and Renesas has not yet published a GPIO count for the WLCSP, so designers should not assume all 10 are available on the 9-ball part.

Where it sits in the GreenPAK line

GreenPAK ICs let designers combine analog and digital system functions in small, low-power devices, taking over glue-logic functions that would otherwise need discrete components. Renesas says it has shipped more than four billion GreenPAK devices worldwide, and it claims the SLG46801 offers "one of the lowest costs per GPIO in the GreenPAK family." The product page compares it with three related parts: the SLG46108 (OTP, 8-lead STQFN, 6 GPIOs), the SLG46824 (MTP, 20-lead TQFN or TSSOP, 17 GPIOs) and the SLG46811 (OTP, 12-lead TQFN, 10 GPIOs). Jason Kim, Vice President and General Manager of the Core Analog Division at Renesas, said in the release: "The SLG46801 expands our GreenPAK portfolio with an ultra-compact WLCSP option and flexible in-system configurability, helping customers create smaller, more feature-rich products and implement updates even after deployment."

Price and availability

The SLG46801 is announced, not yet in volume production. The STQFN package is sampling now, and Renesas plans mass production of the WLCSP package for November 2026. Renesas has not announced a launch price; its product page lists the SLG46801V-PR at USD 0.275, marked out of stock, as of October 20, 2026.

What It Means for Makers

Renesas aims the WLCSP at products where board space is tight, such as smart rings, smartwatches, fitness bands, VR glasses and portable electronics. It also lists consumer electronics, handheld devices, smart-home systems, networking and communications, computing and storage, industrial control and IoT sensor nodes as target markets. For anyone wanting to try the part now, the STQFN is the package that is sampling.

The practical gain for prototyping is that a GreenPAK design no longer has to be final at first programming: because the I²C bus that talks to the system also reprograms the MTP memory, logic can be revised on an assembled board. Designs are created in Renesas's Go Configure Software Hub, a free GUI-based development environment that Renesas says is available for programming, emulation and simulation. For pinouts, electrical limits and layout guidance, use the datasheet linked from the product page; the part is still labeled "Preview", so expect details to firm up as the WLCSP reaches production.

Sources